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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - The mechanical simulation of a special biosensor
Wang, Shuaipeng, Tian, Hongxun, Zhang, Xinghui, Li, Jianqiang, Chen, Yanning, Wang, Wenhe, Yuan, Yidong, Zhang, Haifeng, Wang, Yubo, Zhao, DongyanYear:
2018
Language:
english
DOI:
10.1109/icept.2018.8480624
File:
PDF, 7.27 MB
english, 2018