Local tentative bonding method to maintain alignment accuracy in bonding process using resin as an adhesive material
Kondo, Masahiro, Komiyama, Ryohei, Miyashita, Hidetoshi, Lee, Sang-SeokVolume:
2018
Language:
english
Journal:
The Journal of Engineering
DOI:
10.1049/joe.2017.0801
Date:
May, 2018
File:
PDF, 453 KB
english, 2018