Experimental determination of the Young's modulus of copper...

Experimental determination of the Young's modulus of copper and solder materials for electronic packaging

Kraemer, F., Roellig, M., Metasch, R., Ahmar, J., Meier, K., Wiese, S.
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Volume:
91
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.002
Date:
December, 2018
File:
PDF, 1.44 MB
english, 2018
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