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Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Kraemer, F., Roellig, M., Metasch, R., Ahmar, J., Meier, K., Wiese, S.Volume:
91
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.002
Date:
December, 2018
File:
PDF, 1.44 MB
english, 2018