Effect of Joule heating on the reliability of solder joints under power cycling conditions
Mei, J., Haug, R., Lanier, O., Grözinger, T., Zimmermann, A.Volume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.053
Date:
September, 2018
File:
PDF, 12.86 MB
english, 2018