[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Design, Fabrication and Characterization of Silicon based Microfluidic Structures for High Heat-flux Cooling Application
Li, Yangyang, Lu, Qian, Chen, Xiancai, Zhang, Jian, Lin, Jia, Xiang, WeiweiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480811
File:
PDF, 4.71 MB
english, 2018