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[IEEE 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2018.9.4-2018.9.6)] 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - An Alternative Packaging Solution in Achieving Moisture Sensitivity Level One (1) for Small Outline Integrated Circuit (SOIC) Automotive Packages
Denoyo, Alvin B., Delos Santos, Rod J., Pinili, Ton C., De Lazo, Darwin J., Costa, Ivan T. Gil, Menor, Allen M.Year:
2018
Language:
english
DOI:
10.1109/IEMT.2018.8511792
File:
PDF, 346 KB
english, 2018