[IEEE 2018 IEEE 38th International Electronics...

  • Main
  • [IEEE 2018 IEEE 38th International...

[IEEE 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2018.9.4-2018.9.6)] 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - An Alternative Packaging Solution in Achieving Moisture Sensitivity Level One (1) for Small Outline Integrated Circuit (SOIC) Automotive Packages

Denoyo, Alvin B., Delos Santos, Rod J., Pinili, Ton C., De Lazo, Darwin J., Costa, Ivan T. Gil, Menor, Allen M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2018
Language:
english
DOI:
10.1109/IEMT.2018.8511792
File:
PDF, 346 KB
english, 2018
Conversion to is in progress
Conversion to is failed