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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Analysis and optimization of coupling noise in TSV array
Mei, Zheng, Dong, Gang, Zhu, Weijun, Chai, Jingrui, Zheng, Junping, Song, DongliangYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480511
File:
PDF, 4.32 MB
english, 2018