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[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Signal/Power Integrity Tradeoffs in Automotive SoC Package Design (LPDDR4 Case Study)
Silva, Benjamin, FenShen, Yan, Eldessouki, MohamedYear:
2018
Language:
english
DOI:
10.1109/EPEPS.2018.8534198
File:
PDF, 383 KB
english, 2018