[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Design and implementation of semiconductor Laser reliability testing platform
Su, Meng, Lu, Guoguang, Xu, Huawei, Peng, Qi, Huang, LinyiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480726
File:
PDF, 4.49 MB
english, 2018