The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes with Underfill Encapsulation
Shang, Andrew W., Lo, Jeffery C. C., Lee, S. W. RickyYear:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2881178
File:
PDF, 887 KB
english, 2018