Investigation of Formation and Growth Behavior of Cu/Al...

Transactions of The Japan Institute of Electronics Packaging 2014 Vol. 7; Iss. 1

Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging

Mokhtari, Omid, Kim, Min-Su, Nishikawa, Hiroshi, Kawashiro, Fumiyoshi, Itoh, Satoshi, Maeda, Takehiko, Hirose, Tetsuya, Eto, Takaki
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
7
Year:
2014
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.7.1
File:
PDF, 3.40 MB
english, 2014
Conversion to is in progress
Conversion to is failed