[IEEE 2018 IEEE International Conference on Electron...

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[IEEE 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC) - Shenzhen (2018.6.6-2018.6.8)] 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC) - A Study about the Different Corrosion Behavior between Cu/Mo Bilayer and Mo/Cu/Mo Three-layer Metal Electrode

Wu, Yue, Yong, Weina, Chen, Shu-Jhih, Lee, Chia-Yu, Zhou, Hang
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Year:
2018
Language:
english
DOI:
10.1109/EDSSC.2018.8487162
File:
PDF, 1.65 MB
english, 2018
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