Room Temperature Bonding of Wafers Using Si and Ge Films with Extremely Low Electrical Conductivity
Uomoto, Miyuki, Muraoka, Arina, Shimatsu, TakehitoVolume:
86
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/08605.0199ecst
Date:
July, 2018
File:
PDF, 432 KB
english, 2018