[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Investigation on Copper Clip Bonding Structure for Power Package
Liu, Linqi, Jiang, Wei, Liu, Qiang, Lin, Wei, Miao, Xiaoyong, Shi, LeiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480731
File:
PDF, 4.41 MB
english, 2018