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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - EMC Modeling and Simulation in Quad Flat Package
Haiyan, SUN, Shoukun, HUANG, Ling, SUN, Jicong, ZHAO, Yihong, PENG, Jiaen, FANG, Xiaoyong, MIAO, Honghui, WANGYear:
2018
Language:
english
DOI:
10.1109/icept.2018.8480618
File:
PDF, 4.92 MB
english, 2018