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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Determination of Package Die Temperature in a Set-Top Box Using JEDEC Thermal Metrics
Celik, ZekiYear:
2003
Language:
english
DOI:
10.1115/ipack2003-35212
File:
PDF, 332 KB
english, 2003