Interplay of structural, electronic, and transport features...

Journal of Alloys and Compounds 2019 / 03 Vol. 777

Interplay of structural, electronic, and transport features in copper alloys

Maier, Frank C., Hocker, Stephen, Schmauder, Siegfried, Fyta, Maria
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
777
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2018.10.340
Date:
March, 2019
File:
PDF, 1.59 MB
english, 2019
Conversion to is in progress
Conversion to is failed