Investigation of Transient Current Characteristics with Scaling-down Poly-Si Body Thickness and Grain size of 3D NAND Flash Memory
Lee, Sang-Ho, Woong Kwon, Dae, Kim, Seunghyun, Baek, Myung-Hyun, Lee, Sungbok, Kang, Jinkyu, Jang, Woojae, Park, Byung-GookLanguage:
english
Journal:
Solid-State Electronics
DOI:
10.1016/j.sse.2018.11.009
Date:
November, 2018
File:
PDF, 984 KB
english, 2018