[IEEE 2018 19th International Conference on Electronic...

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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of active agents on the rheological properties of SnAgCu solder pastes used for jetting printing

Li, Saipeng, Zhang, Xuemei, Hao, Jian, Zhou, Jian, Xue, Feng
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Year:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480669
File:
PDF, 8.40 MB
english, 2018
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