Modeling and Experimental Verification of Intermetallic...

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Journal of Electronic Materials 2018 / 11

Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders

Baek, Sung-Min, Park, Yujin, Oh, Cheolmin, Chun, Eun-Joon, Kang, Namhyun
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Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-018-6786-4
Date:
November, 2018
File:
PDF, 1.88 MB
english, 2018
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