![](/img/cover-not-exists.png)
[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A New Method in Creating Carrier Package for Repackage
Liu, Homg-Chang, Chung, Chun-Hsiung, Huang, Shou-MingYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452586
File:
PDF, 1.03 MB
english, 2018