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Stability of diamond/Si bonding interface during device fabrication process
Liang, Jianbo, Masuya, Satoshi, Kim, Seongwoo, Oishi, Toshiyuki, Kasu, Makoto, Shigekawa, NaoteruVolume:
12
Language:
english
Journal:
Applied Physics Express
DOI:
10.7567/1882-0786/aaeedd
Date:
January, 2019
File:
PDF, 873 KB
english, 2019