Influence of tungsten carbide (WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints
Yang, Li, Wang, Guoqiang, Zhang, Yaocheng, Xiong, Yifeng, Jiang, WeiVolume:
124
Language:
english
Journal:
Applied Physics A
DOI:
10.1007/s00339-018-2255-4
Date:
December, 2018
File:
PDF, 4.37 MB
english, 2018