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Initial stage of isothermal wetting of bulk Cu6Sn5, Cu3Sn and Cu substrates by liquid Sn
Liashenko, O. Y., Hodaj, F.Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-0456-4
Date:
December, 2018
File:
PDF, 2.49 MB
english, 2018