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The fast formation of full Cu3Sn solder joints in Cu/Sn/Cu system by thermal gradient bonding
Yin, Zuozhu, Sun, Fenglian, Guo, MengjiaoLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-0486-y
Date:
December, 2018
File:
PDF, 1.47 MB
english, 2018