Stabilisation of Cu films in WO3/Ag/Cu:Al/WO3 structures...

Thin Solid Films 2019 / 01 Vol. 669

Stabilisation of Cu films in WO3/Ag/Cu:Al/WO3 structures through their doping by Al and Ag

Rabia, D.-E., Blais, M., Essaidi, H., Stephant, N., Louarn, G., Morsli, M., Touihri, S., Bernède, J.C., Cattin, L.
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Volume:
669
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2018.11.059
Date:
January, 2019
File:
PDF, 1.79 MB
english, 2019
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