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Material removal mechanism of precision grinding of soft-brittle CdZnTe wafers
Zhenyu Zhang, Yaowu Meng, Dongming Guo, Lailei Wu, Yongjun Tian, Riping LiuVolume:
46
Language:
english
Pages:
7
DOI:
10.1007/s00170-009-2114-8
Date:
January, 2010
File:
PDF, 488 KB
english, 2010