Fabrication of a Bilayer Structure of Cu and Polyimide to...

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ACS Applied Materials & Interfaces 2018 / 12

Fabrication of a Bilayer Structure of Cu and Polyimide to Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices

Kubo, Yugo, Tanaka, Hirokazu, Saito, Yoshihiro, Mizoguchi, Akira
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Language:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.8b15835
Date:
December, 2018
File:
PDF, 1.33 MB
english, 2018
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