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[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Würzburg (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - Optimized Thermoforming Process for Conformable Electronics
Kallmayer, Christine, Schaller, Florian, Loher, Thomas, Haberland, Julian, Kayatz, Fabian, Schult, AndreYear:
2018
Language:
english
DOI:
10.1109/ICMID.2018.8526929
File:
PDF, 309 KB
english, 2018