Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
Choe, Chanyang, Chen, Chuantong, Noh, Seungjun, Suganuma, KatsuakiVolume:
11
Language:
english
Journal:
Materials
DOI:
10.3390/ma11122394
Date:
November, 2018
File:
PDF, 13.44 MB
english, 2018