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Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
Shang, Andrew W., Lo, Jeffery C. C., Lee, S. W. RickyYear:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2869641
File:
PDF, 669 KB
english, 2018