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The Measurement of Optical Interconnect Module Post-Soldering Alignment Offsets and The Study of Its Influence on Optical Coupling Efficiency
Huang, Chunyue, Lu, Liangkun, Shao, Liangbin, Liang, YingYear:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2876330
File:
PDF, 3.18 MB
english, 2018