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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - UV Assisted Chip-on-Wafer Direct Transfer Bonding (CoW DTB)
Kurita, Yoichiro, Warabi, Kaori, Uemura, Hiroshi, Furuyama, Hideto, Ohira, Kazuya, Kakumoto, Yasuhide, Abe, Tomoyuki, Inamura, MikiYear:
2018
Language:
english
DOI:
10.1109/ESTC.2018.8546377
File:
PDF, 846 KB
english, 2018