Metallographic Sectioning and Grinding Damage Analysis...

Metallographic Sectioning and Grinding Damage Analysis Through the Use of Color Metallography and Electron Backscatter Diffraction (EBSD)

Lucas, GM, Voort, GF Vander, Philippe, P, Lagacé, M, Hovington, P
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Volume:
15
Language:
english
Journal:
Microscopy and Microanalysis
DOI:
10.1017/s1431927609093246
Date:
July, 2009
File:
PDF, 481 KB
english, 2009
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