Add-on microchannels for hot spot thermal management of microelectronic chips in compact applications
Collin, L.-M., Colonna, J.-P., Coudrain, P., Shirazy, M. R. S., Cheramy, S., Souifi, A., Frechette, L. G.Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2874241
File:
PDF, 1.61 MB
english, 2018