[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A novel graphene oxide millispheres / epoxy resin composite with improved thermal conductivity
Li, Chen, Zeng, Xiaoliang, Zhu, Deliang, Sun, Rong, Xu, Jianbin, Wong, Ching-pingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480514
File:
PDF, 4.79 MB
english, 2018