[AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: Tenth International Workshop on Stress-Induced Phenomena in Metallization - Austin (Texas) (5–7 November 2008)] AIP Conference Proceedings - Dynamical X-ray Microscopy Study of Stress-Induced Voiding in Cu Interconnects
Heim, S., Friedrich, D., Guttmann, P., Rehbein, S., Chumakov, D., Ritz, Y., Schneider, G., Schmeisser, D., Zschech, E., Ho, Paul S., Zschech, Ehrenfried, Ogawa, ShinichiYear:
2009
Language:
english
DOI:
10.1063/1.3169261
File:
PDF, 4.20 MB
english, 2009