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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Ni thickness on the IMC and reliability of ultrathin ENEPIG
Pan, Hongfa, Wang, Yibo, Luo, Weiguo, Gao, Liming, Li, MingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480796
File:
PDF, 5.04 MB
english, 2018