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[IEEE 2018 International Semiconductor Conference (CAS) - Sinaia, Romania (2018.10.10-2018.10.12)] 2018 International Semiconductor Conference (CAS) - Low-Temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration
Stoukatch, S., Dupont, F., Kraft, M.Year:
2018
DOI:
10.1109/SMICND.2018.8539847
File:
PDF, 452 KB
2018