Thermomechanical Durability of High I/O BGA Packages
Davuluri, P., Shetty, S., Dasgupta, A., Young, S.Volume:
124
Year:
2002
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1477192
File:
PDF, 683 KB
english, 2002