Study on strain rate and heat effect on the removal...

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International Journal of Mechanical Sciences 2018 / 12

Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation

Meng, Binbin, Yuan, Dandan, Xu, Shaolin
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Language:
english
Journal:
International Journal of Mechanical Sciences
DOI:
10.1016/j.ijmecsci.2018.12.022
Date:
December, 2018
File:
PDF, 1.64 MB
english, 2018
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