[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Advanced EWLB (Embedded Wafer Level Ball Grid Array) Solutions for Mmwave Applications
Wang, Dian, An, Fazhi, Yoon, Seung WookYear:
2018
Language:
english
DOI:
10.23919/IWLPC.2018.8573266
File:
PDF, 529 KB
english, 2018