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Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
Noh, Seungjun, Zhang, Hao, Suganuma, KatsuakiVolume:
11
Language:
english
Journal:
Materials
DOI:
10.3390/ma11122531
Date:
December, 2018
File:
PDF, 9.23 MB
english, 2018