[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Würzburg (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates
Roudenko, Jewgeni, Schirmer, Julian, Reichenberger, Marcus, Neermann, Simone, Franke, JorgYear:
2018
Language:
english
DOI:
10.1109/ICMID.2018.8527048
File:
PDF, 447 KB
english, 2018