[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Cantilever Gold Ribbon Bonding used in MMCM
Zongjie, Han, Le, Jie, Wei, Yan, Yongfang, Hu, Xiaoxuan, LiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480830
File:
PDF, 3.52 MB
english, 2018