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[IEEE 2018 1st IEEE International Conference on Knowledge Innovation and Invention (ICKII) - Jeju Island, Korea (South) (2018.7.23-2018.7.27)] 2018 1st IEEE International Conference on Knowledge Innovation and Invention (ICKII) - Evaluation of tensile strength of 3D printed objects with FDM process on RepRap platform
Kung, Chieh, Kuan, Hsu-Chiang, Kuan, Chen-FengYear:
2018
DOI:
10.1109/ICKII.2018.8569166
File:
PDF, 157 KB
2018