In-line Metrology for Characterization and Control of...

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IEEE Transactions on Semiconductor Manufacturing 2018

In-line Metrology for Characterization and Control of Extreme Wafer Thinning of Bonded Wafers

Liebens, M., Jourdain, A., De Vos, J., Vandeweyer, T., Miller, A., Beyne, E., Li, S., Bast, G., Stoerring, M., Hiebert, S., Cross, A.
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2018.2885577
File:
PDF, 1.13 MB
english, 2018
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