![](/img/cover-not-exists.png)
[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics
Lall, Pradeep, Harsha, Mahendra, Suhling, Jeff, Goebel, KaiYear:
2013
Language:
english
DOI:
10.1115/ipack2013-73251
File:
PDF, 2.78 MB
english, 2013