Microstructural Evolution of Sn-58Bi/Cu Joints through...

MATERIALS TRANSACTIONS 2017 Vol. 58; Iss. 11

Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

Wang, Fengjiang, Liu, Luting, Zhou, Lili, Wang, Jiheng, Wu, Mingfang, Wang, Xiaojing
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Volume:
58
Year:
2017
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.m2017162
File:
PDF, 6.50 MB
english, 2017
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