[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering
Bin, Yao, Xiaofeng, Wang, Yabing, ZouYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480530
File:
PDF, 4.63 MB
english, 2018